Manufacturing Process Flow

STC has its integrated production system, such as from crystal growing to final surface polishing. Single crystal growing, cutting, and Cylindrical works, which include the CZ process. CW process slices as wafer shape from single-crystal ingots after cylindrical work, making them in good flatness on the wafer surface by polishing or chemicals. For the PW process, create a polished mirror surface by 3 step polishment. As per the customer's request, STC will also add special treatment such as backside damage.

Special arrangement

STC also applies backside damage treatment, oxide layer process, and laser scribing.